Marimpul, Rinaldo
Syuhada, Ibnu
Rosikhin, Ahmad
Winata, Toto
Funding for this research was provided by:
The Ministry of Research & Technology and Higher Educations of Republic Indonesia
Journal title: Materials Research Express
Article type: paper
Article title: Effect of copper film catalyst substrate thickness on atomic diffusion time at the initiation of the recrystallization stage: a molecular dynamics study
Copyright information: © 2017 IOP Publishing Ltd
Publication dates
Date received: 2016-11-18
Date accepted: 2017-02-22
Online publication date: 2017-03-22