Liu, Ya https://orcid.org/0000-0001-8040-6972
Dai, Chaolun
Pei, Yu
Zhang, Peng
Tao, Yi
Chen, Yunfei https://orcid.org/0000-0002-8682-868X
Zhao, Yang https://orcid.org/0000-0002-3962-2793
Funding for this research was provided by:
Nation Natural Science Foundation of China (11572311, 51732006)
Journal title: Materials Research Express
Article type: paper
Article title: Thermal interfacial coupling between electroplated copper and indium
Copyright information: © 2018 IOP Publishing Ltd
Publication dates
Date received: 2018-05-22
Date accepted: 2018-08-08
Online publication date: 2018-08-17