Funding for this research was provided by:
National Natural Science Foundation of China (Nos. 51465039 and 51765040)
Natural Science Foundation of Jiangxi Province (20161BAB206122)
Journal title: Materials Research Express
Article type: paper
Article title: Effect of Bi on microstructure and mechanical properties of Sn-10Sb-1.5Cu (SSC1015) solder alloys
Copyright information: © 2018 IOP Publishing Ltd
Publication dates
Date received: 2018-10-15
Date accepted: 2018-11-19
Online publication date: 2018-11-28