Funding for this research was provided by:
National Natural Science Foundation of China (51875269)
Journal title: Materials Research Express
Article type: paper
Article title: Atomic migration on Cu in Sn-58Bi solder from the interaction between electromigration and thermomigration
Copyright information: © 2019 IOP Publishing Ltd
Publication dates
Date received: 2018-11-24
Date accepted: 2018-12-13
Online publication date: 2019-01-04