Funding for this research was provided by:
Opening Project of Jiangsu Key Laboratory of Advanced Structural Materials and Application Technology (ASMA201602)
Open Fund of Key Laboratory of Materials Preparation and Protection for Harsh Environment (56XCA17006-1)
National Natural Science Foundation of China (51004039)
Journal title: Materials Research Express
Article type: paper
Article title: Effect of thixotropic agents on the rheology of SnAgCu lead-free solder pastes used for jet printing
Copyright information: © 2019 IOP Publishing Ltd
Publication dates
Date received: 2018-11-15
Date accepted: 2019-01-31
Online publication date: 2019-02-08