Funding for this research was provided by:
National Natural Science Foundation of China (No.11604222)
Natural Science Foundation of Liaoning Province, China (No. 201601155)
Journal title: Materials Research Express
Article type: paper
Article title: Evolution of microstructure and effects on crack formation of Sn3.0Ag0.5Cu/Cu solder joints under accelerated thermal cycling
Copyright information: © 2019 IOP Publishing Ltd
Publication dates
Date received: 2018-12-06
Date accepted: 2019-03-25
Online publication date: 2019-04-05