Funding for this research was provided by:
Natural Science Foundation of China (51875177)
Journal title: Materials Research Express
Article type: paper
Article title: Growth characterization of intermetallic compounds at the Cu/Al solid state interface
Copyright information: © 2019 IOP Publishing Ltd
Publication dates
Date received: 2019-04-05
Date accepted: 2019-07-11
Online publication date: 2019-08-14