Funding for this research was provided by:
National Natural Science Foundation of China (51604090)
Natural Science Foundation of Heilongjiang Province (E2017050)
Journal title: Materials Research Express
Article type: paper
Article title: Effect of porous Cu addition on the microstructure and properties of Sn58Bi solder joints
Copyright information: © 2019 IOP Publishing Ltd
Publication dates
Date received: 2019-07-26
Date accepted: 2019-09-11
Online publication date: 2019-09-25