Shu, Tie
Gao, He
Wei, Fuxiang https://orcid.org/0000-0001-6467-4096
Lin, Caixia
Sui, Yanwei
Qi, Jiqiu
Funding for this research was provided by:
Postgraduate Research & Practice Innovation Program of China University of Mining and Technology (KYCX19_2197)
Postgraduate Research & Practice Innovation Program of Jiangsu Province (KYCX19_2197)
Journal title: Materials Research Express
Article type: paper
Article title: Role of Ni impurities in solid-state diffusion of intermetallic compounds in the Sn-0.7Cu-10Bi-xNi/Ni interface reaction
Copyright information: © 2019 IOP Publishing Ltd
Publication dates
Date received: 2019-08-07
Date accepted: 2019-09-30
Online publication date: 2019-10-11