Xiaoguang, Liu
Xiaoming, Jiang
Lichao, Cao https://orcid.org/0000-0002-9560-5429
Wengang, Zhai
Xianfen, Li
Zhou, Wei
Funding for this research was provided by:
Guangdong Province Science and Technology Project (2016B090927008)
the high-level leading talent introduction program of GDAS (2016GDASRC-0106)
GuangZhou Science and Technology Project (201707010480)
Journal title: Materials Research Express
Article type: paper
Article title: Microstructure and properties of Sn-3.8Ag-0.7Cu-xCe lead-free solders with liquid-liquid structure transition and Ce addition
Copyright information: © 2019 IOP Publishing Ltd
Publication dates
Date received: 2019-07-16
Date accepted: 2019-10-11
Online publication date: 2019-10-23