Funding for this research was provided by:
National Natural Science Foundation of China (51775088)
Journal title: Materials Research Express
Article type: paper
Article title: Study on reducing side etching of Copper microelectrode by multi-step etching process
Copyright information: © 2019 IOP Publishing Ltd
Publication dates
Date received: 2019-07-02
Date accepted: 2019-11-15
Online publication date: 2019-11-27