Yahaya, Muhamad Zamri
Nazeri, Muhammad Firdaus Mohd
Kheawhom, Soorathep
Illés, Balázs
Skwarek, Agata
Mohamad, Ahmad Azmin http://orcid.org/0000-0001-5525-7100
Funding for this research was provided by:
FRGS (203.PBahan.6071377 (Ref: FRGS/1/2017/TK05/USM/02/2)
Regionalna Inicjatywa Doskonałości (006/RID/2018/19)
National Research, Development, and Innovation Office (NKFIH, FK 127970)
Journal title: Materials Research Express
Article type: paper
Article title: Microstructural analysis of Sn-3.0Ag-0.5Cu-TiO2 composite solder alloy after selective electrochemical etching
Copyright information: © 2020 The Author(s). Published by IOP Publishing Ltd
License information: cc-by Original content from this work may be used under the terms of the Creative Commons Attribution 4.0 licence. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.
Publication dates
Date received: 2019-10-19
Date accepted: 2020-01-14
Online publication date: 2020-01-27