Funding for this research was provided by:
the State Key Laboratory of Rolling and Automation, Northeastern University (No.2019RALKFKT011)
Fundamental Research Funds for the Central Universities (No. N170704015)
National Natural Science Foundation of China (No. 50971039)
Article Title: Microstructure-based modeling of IMC layer thickness effect on tensile behavior of Cu/Al clad strip
Journal Title: Materials Research Express
Article Type: paper
Copyright Information: © 2020 The Author(s). Published by IOP Publishing Ltd
Publication dates
Date Received: 2019-10-07
Date Accepted: 2020-01-15
Online publication date: 2020-01-27