Funding for this research was provided by:
Natural Science Foundation of Guangdong Province (2019A1515012096)
Key-Area Research and Development Program of Guangdong Province (2019B010942001)
Science and Technology Planning Project of Guangzhou (201906040007)
Article Title: Microstructure, adhesion strength and thermal conductivity of AlN/(Ti, W)/Cu substrate system
Journal Title: Materials Research Express
Article Type: paper
Copyright Information: © 2020 The Author(s). Published by IOP Publishing Ltd
Publication dates
Date Received: 2020-09-22
Date Accepted: 2020-10-13
Online publication date: 2020-10-21