Hsieh, Chi-Hsiang
Lee, Ming-Hsun
Chen, Chao-Chang A
Tu, Chang-Ching https://orcid.org/0000-0002-9233-1928
Kuo, Hao-Chung
Funding for this research was provided by:
the Hon Hai Research Institute, Foxconn Technology Group
Article Title: Contamination reduction for 150 mm SiC substrates by integrating CMP and Post-CMP cleaning
Journal Title: Materials Research Express
Article Type: paper
Copyright Information: © 2023 The Author(s). Published by IOP Publishing Ltd
Publication dates
Date Received: 2023-05-10
Date Accepted: 2023-10-05
Online publication date: 2023-10-16