Jagan, Rohith
Gurung, Twinkle
Shanubhogue U, Deepika
Poojitha, G
P, Poornesh https://orcid.org/0000-0002-3608-6294
Rao, Ashok
Funding for this research was provided by:
Department of Science and Technology, Ministry of Science and Technology, India (SR/FIST/PS-1/2017/8)
Manipal Academy of Higher Education
Council of Scientific and Industrial Research, India (Sanction no: 03(1409)/17/EMR-II)
Article Title: Incorporation of Ni in Cu2SnSe3: An insight into the reduction in electrical resistivity
Journal Title: Materials Research Express
Article Type: paper
Copyright Information: © 2024 The Author(s). Published by IOP Publishing Ltd
Publication dates
Date Received: 2024-05-08
Date Accepted: 2024-07-18
Online publication date: 2024-07-29