Funding for this research was provided by:
Jianbing Lingyan Project (2023c04050)
Open Project of "State Key Laboratory of Silicon and Advanced Semiconductor Materials" : Study on Ultrasonic Nondestructive Testing of Defects in Semiconductor Silicon Carbide Single Crystals (SKL2024-07)
Open Fund of Hubei Key Laboratory of Electronic Manufacturing and Packaging Integratio (Grant No. EMPI2024007)
Article Title: Innovative design and process simulation of aviation bracket based on topology optimization and additive manufacturing
Journal Title: Materials Research Express
Article Type: paper
Copyright Information: © 2024 The Author(s). Published by IOP Publishing Ltd
Publication dates
Date Received: 2024-06-14
Date Accepted: 2024-10-29
Online publication date: 2024-11-06