Lee, Dongmyeong
Lee, Hoogwan
Choi, Junyoung
Jang, Suin
Kim, Sarah Eunkyung https://orcid.org/0000-0001-5210-3819
Funding for this research was provided by:
Ministry of Trade, Industry & Energy (1415187584)
National Research Foundation of Korea (2022M3I7A4072293)
K-CHIPS (RS-2023-00236091)
Article Title: C2H4 reductive plasma treatment on copper surface for copper bonding
Journal Title: Materials Research Express
Article Type: paper
Copyright Information: © 2025 The Author(s). Published by IOP Publishing Ltd
Publication dates
Date Received: 2025-03-21
Date Accepted: 2025-05-22
Online publication date: 2025-05-30