Hümmer, Michael https://orcid.org/0000-0002-6062-0354
Roudenko, Jewgeni
Wenger, Thomas
Reichenberger, Marcus
Article Title: Mechanical characterization of solder interconnections on functionalized, copper-containing polymer thick-film pastes for hybrid integration
Journal Title: Flexible and Printed Electronics
Article Type: paper
Copyright Information: © 2022 The Author(s). Published by IOP Publishing Ltd
Publication dates
Date Received: 2022-05-25
Date Accepted: 2022-07-27
Online publication date: 2022-08-10