Fortier, François-Xavier https://orcid.org/0000-0003-4885-6775
Gerlein, Luis-Felipe https://orcid.org/0000-0001-6188-5330
Benavides-Guerrero, Jaime https://orcid.org/0000-0002-9284-239X
Wadhwa, Arjun https://orcid.org/0000-0002-8026-5257
Shah, Krunal https://orcid.org/0009-0001-0771-5637
Taherian, Mohamad Hassan https://orcid.org/0000-0001-5377-3654
Perrotton, Alexandre https://orcid.org/0009-0007-1510-0062
Bolduc, Martin https://orcid.org/0009-0008-2758-7573
Cloutier, Sylvain G https://orcid.org/0000-0003-0092-5241
Funding for this research was provided by:
NSERC-Discovery program (RGPIN 2022-03083)
Canada Research Chair program (CRC-2021-00490)
Article Title: Improving solder wettability atop screen-printed copper for flexible hybrid electronic circuit assembly
Journal Title: Flexible and Printed Electronics
Article Type: paper
Copyright Information: © 2025 The Author(s). Published by IOP Publishing Ltd
Publication dates
Date Received: 2025-09-10
Date Accepted: 2025-10-31
Online publication date: 2025-11-19