Weninger, Drew https://orcid.org/0009-0003-5334-2426
Duessel, Christian
Serna, Samuel https://orcid.org/0000-0003-0269-0589
Kimerling, Lionel
Agarwal, Anuradha https://orcid.org/0000-0001-5264-1123
Funding for this research was provided by:
Innovation and Technology Ecosystems (2345076)
Article Title: Graded index couplers for next generation chip-to-chip and fiber-to-chip photonic packaging
Journal Title: Journal of Physics: Photonics
Article Type: paper
Copyright Information: © 2025 The Author(s). Published by IOP Publishing Ltd
Publication dates
Date Received: 2025-09-12
Date Accepted: 2025-10-22
Online publication date: 2025-11-07