Zhang, Jieyuan
Hu, Yanlei https://orcid.org/0000-0003-1964-0043
Wang, Fangcheng
Liu, Qiang
Niu, Fangfang
Li, Jinhui
Huang, Mingqi
Zhang, Guoping https://orcid.org/0000-0002-0683-495X
Sun, Rong
Funding for this research was provided by:
Natural Science Foundation of Guangdong Province (2024A1515010123)
Guangdong Special Support Plan (2021TX06C101)
National Natural Science Foundation of China (62174170)
Article Title: Precise modulation of the debonding behaviours of ultra-thin wafers by laser-induced hot stamping effect and thermoelastic stress wave for advanced packaging of chips
Journal Title: International Journal of Extreme Manufacturing
Article Type: paper
Copyright Information: © 2024 The Author(s). Published by IOP Publishing Ltd on behalf of the IMMT
Publication dates
Date Received: 2023-07-04
Date Accepted: 2024-10-21
Online publication date: 2024-11-13