Jiang, Bing-Xin https://orcid.org/0009-0008-2062-1054
Chen, Hui
Zhang, Wen-Jing
Lan, Jin-Hua
Yang, Tian-Xi
Lin, Chang
Huang, Zhong-Hang
Zhang, Kai-Xin
Zhu, Xue-Qi
He, Jun
Yang, Yi-Fan
Zhang, Yong-Ai
Funding for this research was provided by:
National Key Research and Development Program of China (Nos. 2023YFB3608700)
Article Title: Fabrication and bonding of In bumps on Micro-LED with 8 μm pixel pitch
Journal Title: Engineering Research Express
Article Type: paper
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Publication dates
Date Received: 2024-01-03
Date Accepted: 2024-03-20
Online publication date: 2024-04-04