Hanumanth Rao, C
Singh, Amrendra Pratap
Varaprasad, B K S V L
R, Selvi
Venkata Govinda Rao, D
Goel, Sanket https://orcid.org/0000-0002-9739-4178
Article Title: Materials and manufacturing technology for high reliability rigid-flex multilayer PCB for space 3D-electronics packaging
Journal Title: Engineering Research Express
Article Type: paper
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Publication dates
Date Received: 2024-01-12
Date Accepted: 2024-04-25
Online publication date: 2024-05-15