Wu, Zhiyuan https://orcid.org/0009-0009-8159-5854
Dai, Zehui https://orcid.org/0009-0009-2016-7370
Ye, Guo https://orcid.org/0009-0008-8083-465X
Peng, Jinsong
He, Zhenzhi https://orcid.org/0000-0003-2070-2790
Lu, Xiangning https://orcid.org/0000-0002-2932-0185
Funding for this research was provided by:
Postgraduate Research & Practice Innovation Program of Jiangsu Normal University (2024XKT0668)
National Natural Science Foundation of China (52075231)
Natural Science Foundation of Jiangsu Province (BK20201023)
Article Title: Thermal analysis of a novel fan-out packaging structure optimized with graphene
Journal Title: Engineering Research Express
Article Type: paper
Copyright Information: © 2025 IOP Publishing Ltd. All rights, including for text and data mining, AI training, and similar technologies, are reserved.
Publication dates
Date Received: 2025-04-07
Date Accepted: 2025-06-16
Online publication date: 2025-06-25