Ge, Haoyu
Liu, Jialin
Sebek, Matej https://orcid.org/0000-0002-5196-6951
Li, Zhuoshen
Fu, Wei https://orcid.org/0000-0001-5018-1960
Wang, Ziyu https://orcid.org/0000-0002-0959-4787
Wang, Zeng https://orcid.org/0000-0002-0730-8601
Funding for this research was provided by:
Science and Engineering Research Council (SERC) of the Agency for Science, Technology and Research (M23M7c0116)
Article Title: AI-assisted wafer-scale exfoliation and transfer of 2D materials: status, challenges and perspectives
Journal Title: AI for Science
Article Type: paper
Copyright Information: © 2025 The Author(s). Published by IOP Publishing Ltd on behalf of the Songshan Lake Materials Laboratory
Publication dates
Date Received: 2025-05-15
Date Accepted: 2025-09-03
Online publication date: 2025-09-24