Funding for this research was provided by:
the Ministry of Science and Technology, Taiwan (MOST 107-2221-E-150-002-MY2)
Journal title: Journal of The Electrochemical Society
Article type: paper
Article title: Electrochemical Anodization of 2-nm-Thick Tantalum Films for Self-Assembling of Molecularly Thick Layer as a Barrier for Copper
Copyright information: © 2020 The Electrochemical Society (“ECS”). Published on behalf of ECS by IOP Publishing Limited
Publication dates
Date received: 2020-05-26
Online publication date: 2020-07-17