Funding for this research was provided by:
the Ministry of Science and Technology, Taiwan (MOST 107-2221-E-150-002-MY2)
Article Title: Electrochemical Anodization of 2-nm-Thick Tantalum Films for Self-Assembling of Molecularly Thick Layer as a Barrier for Copper
Journal Title: Journal of The Electrochemical Society
Article Type: paper
Copyright Information: © 2020 The Electrochemical Society (“ECS”). Published on behalf of ECS by IOP Publishing Limited. All rights, including for text and data mining, AI training, and similar technologies, are reserved.
Publication dates
Date Received: 2020-05-26
Date Accepted:
Online publication date: 2020-07-17