Kim, Tae Young
Lee, Myung Hyun
Byun, Jinuk
Jeon, Hyunwoo
Choe, Seunghoe https://orcid.org/0000-0003-3873-4889
Kim, Jae Jeong https://orcid.org/0000-0002-5270-4128
Funding for this research was provided by:
National Research Foundation of Korea (the Ministry of Science and ICT (2020M3H4A3081762))
Samsung Electromechanics
Ministry of Trade, Industry and Energy (Technology Innovation Program (20000874))
Article Title: Influence of Reducing Agent on Chemical Decomposition of Bis(3- sulfopropyl) Disulfide (SPS) in Cu Plating Bath
Journal Title: Journal of The Electrochemical Society
Article Type: paper
Copyright Information: © 2021 The Electrochemical Society (“ECS”). Published on behalf of ECS by IOP Publishing Limited. All rights, including for text and data mining, AI training, and similar technologies, are reserved.
Publication dates
Date Received: 2021-01-12
Date Accepted:
Online publication date: 2021-03-01