Kim, Tae Young
Lee, Myung Hyun
Byun, Jinuk
Jeon, Hyunwoo
Choe, Seunghoe https://orcid.org/0000-0003-3873-4889
Kim, Jae Jeong https://orcid.org/0000-0002-5270-4128
Funding for this research was provided by:
National Research Foundation of Korea (the Ministry of Science and ICT (2020M3H4A3081762))
Samsung Electromechanics
Ministry of Trade, Industry and Energy (Technology Innovation Program (20000874))
Article Title: Influence of Reducing Agent on Chemical Decomposition of Bis(3- sulfopropyl) Disulfide (SPS) in Cu Plating Bath
Journal Title: Journal of The Electrochemical Society
Article Type: paper
Copyright Information: © 2021 The Electrochemical Society (“ECS”). Published on behalf of ECS by IOP Publishing Limited
Publication dates
Date Received: 2021-01-12
Date Accepted:
Online publication date: 2021-03-01