Funding for this research was provided by:
National Natural Science Foundation of China (NSFC-61574047)
Article Title: Electrodeposition of Cu on CoTa Barrier in the Alkaline CuSO4-Ethylenediamine Solution
Journal Title: Journal of The Electrochemical Society
Article Type: paper
Copyright Information: © 2021 The Electrochemical Society (“ECS”). Published on behalf of ECS by IOP Publishing Limited
Publication dates
Date Received: 2021-03-18
Date Accepted:
Online publication date: 2021-06-02