Kim, S.-H.
Braun, T. M. https://orcid.org/0000-0002-9779-3785
Lee, H.-J. https://orcid.org/0000-0003-3889-9245
Moffat, T. P. https://orcid.org/0000-0003-4377-1692
Josell, D. https://orcid.org/0000-0002-4273-1923
Funding for this research was provided by:
National Research Foundation of Korea (NRF) funded by the Ministry of Education (NRF-2019M3A7B9072142)
Article Title: Microstructure and Texture in Copper Filled Millimeter Scale Through Silicon Vias
Journal Title: Journal of The Electrochemical Society
Article Type: paper
Copyright Information: © 2022 The Electrochemical Society (“ECS”). Published on behalf of ECS by IOP Publishing Limited
Publication dates
Date Received: 2022-01-31
Date Accepted: 2022-03-04
Online publication date: 2022-03-17