Kim, S.-H.
Braun, T. M. https://orcid.org/0000-0002-9779-3785
Lee, H.-J. https://orcid.org/0000-0003-3889-9245
Moffat, T. P. https://orcid.org/0000-0003-4377-1692
Josell, D. https://orcid.org/0000-0002-4273-1923
Funding for this research was provided by:
National Research Foundation of Korea (NRF) funded by the Ministry of Education (NRF-2019M3A7B9072142)
Article Title: Microstructure and Texture in Copper Filled Millimeter Scale Through Silicon Vias
Journal Title: Journal of The Electrochemical Society
Article Type: paper
Copyright Information: © 2022 The Electrochemical Society (“ECS”). Published on behalf of ECS by IOP Publishing Limited. All rights, including for text and data mining, AI training, and similar technologies, are reserved.
Publication dates
Date Received: 2022-01-31
Date Accepted: 2022-03-04
Online publication date: 2022-03-17