Fang, Chuan-Yu
Tran, Dinh-Phuc
Liu, Hung-Che
Ong, Jia-Juen
Lin, Yi-Quan
Hsu, Wei-You
Chen, Chih https://orcid.org/0000-0001-6235-2827
Funding for this research was provided by:
Ministry of Science and Technology, Taiwan (MOST 110-2221-E-A49-075-MY3 and MOST 111-2634-F-A49-008)
Article Title: Effect of Electroplating Current Density on Tensile Properties of Nanotwinned Copper Foils
Journal Title: Journal of The Electrochemical Society
Article Type: paper
Copyright Information: © 2022 The Electrochemical Society (“ECS”). Published on behalf of ECS by IOP Publishing Limited. All rights, including for text and data mining, AI training, and similar technologies, are reserved.
Publication dates
Date Received: 2022-01-09
Date Accepted:
Online publication date: 2022-04-08