Funding for this research was provided by:
Ministry of Science and Technology (MOST 110-2622-8-007-015)
Ministry of Education (None)
Article Title: Influences of Impurity Incorporation in Electroplated Cu on the SnAgCu and Ni-Containing SnAgCu Solder Joints
Journal Title: Journal of The Electrochemical Society
Article Type: paper
Copyright Information: © 2022 The Electrochemical Society (“ECS”). Published on behalf of ECS by IOP Publishing Limited. All rights, including for text and data mining, AI training, and similar technologies, are reserved.
Publication dates
Date Received: 2022-03-28
Date Accepted:
Online publication date: 2022-05-27