Qiu, Li-Na
Ni, Zi-Hong
Wang, Ying-Jie
Hu, Chun-Feng
Qu, Xin-Ping https://orcid.org/0000-0001-6004-7167
Funding for this research was provided by:
National Natural Science Foundation of China (NSFC-61574047)
Article Title: Electroless Deposition of Pure Co on TaN Substrate for Interconnect Metallization
Journal Title: Journal of The Electrochemical Society
Article Type: paper
Copyright Information: © 2022 The Electrochemical Society (“ECS”). Published on behalf of ECS by IOP Publishing Limited. All rights, including for text and data mining, AI training, and similar technologies, are reserved.
Publication dates
Date Received: 2022-06-06
Date Accepted:
Online publication date: 2022-07-28