Qiu, Li-Na
Ni, Zi-Hong
Wang, Ying-Jie
Hu, Chun-Feng
Qu, Xin-Ping https://orcid.org/0000-0001-6004-7167
Funding for this research was provided by:
National Natural Science Foundation of China (NSFC-61574047)
Article Title: Electroless Deposition of Pure Co on TaN Substrate for Interconnect Metallization
Journal Title: Journal of The Electrochemical Society
Article Type: paper
Copyright Information: © 2022 The Electrochemical Society (“ECS”). Published on behalf of ECS by IOP Publishing Limited
Publication dates
Date Received: 2022-06-06
Date Accepted:
Online publication date: 2022-07-28