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Tsai, V. https://orcid.org/0009-0009-7367-5889
Yu, Q. https://orcid.org/0000-0002-2485-5818
Chen, L.
Stauber, M. https://orcid.org/0000-0003-4285-4146
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Stampanoni, M.
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Funding for this research was provided by:
SNF Sinergia (CRSII5 183568)
PHRT-TT (2022-572 INTIMACY)
SNF_R’Equip (206021_189662 “SiDRY”)
SwissLos Fund Canton of Aargau
Article Title: Bottom-up Gold Filling of Trenches in Curved Wafers
Journal Title: Journal of The Electrochemical Society
Article Type: paper
Copyright Information: © 2024 The Electrochemical Society (“ECS”). Published on behalf of ECS by IOP Publishing Limited. All rights, including for text and data mining, AI training, and similar technologies, are reserved.
Publication dates
Date Received: 2024-01-25
Date Accepted:
Online publication date: 2024-03-04