Wang, Zhenyu https://orcid.org/0009-0008-9477-1936
Huo, Hongyu https://orcid.org/0009-0001-6281-6377
Chen, Xia https://orcid.org/0009-0007-5565-7981
Zhao, Xiaonan https://orcid.org/0009-0001-8883-8697
Ding, Shengtao https://orcid.org/0000-0003-1515-2931
Xiao, Ning https://orcid.org/0000-0001-8613-4517
Funding for this research was provided by:
National Natural Science Foundation of China (21902010)
Article Title: A Novel Leveler W-3: Synthesis and Application in Copper Electroplating for Microvia Filling
Journal Title: Journal of The Electrochemical Society
Article Type: paper
Copyright Information: © 2026 The Author(s). Published on behalf of The Electrochemical Society by IOP Publishing Limited
Publication dates
Date Received: 2025-12-17
Date Accepted: 2026-01-27
Online publication date: 2026-02-06