Khanna, Aniruddh J. https://orcid.org/0000-0001-5935-1532
Kakireddy, Veera Raghava
Fung, Jason
Yamamura, Mayu
Jawali, Puneet
Chockalingam, Ashwin
Baradanahalli Kenchappa, Nandan https://orcid.org/0000-0002-5699-9998
Redfield, Daniel
Bajaj, Rajeev
Funding for this research was provided by:
Applied Materials Inc.
Journal title: ECS Journal of Solid State Science and Technology
Article type: paper
Article title: Engineering Surface Texture of Pads for Improving CMP Performance of Sub-10 nm Nodes
Copyright information: © 2020 The Electrochemical Society (“ECS”). Published on behalf of ECS by IOP Publishing Limited
Publication dates
Date received: 2020-06-21
Online publication date: 2020-10-12