Khanna, Aniruddh J. https://orcid.org/0000-0001-5935-1532
Kakireddy, Veera Raghava
Fung, Jason
Yamamura, Mayu
Jawali, Puneet
Chockalingam, Ashwin
Baradanahalli Kenchappa, Nandan https://orcid.org/0000-0002-5699-9998
Redfield, Daniel
Bajaj, Rajeev
Funding for this research was provided by:
Applied Materials Inc.
Article Title: Engineering Surface Texture of Pads for Improving CMP Performance of Sub-10 nm Nodes
Journal Title: ECS Journal of Solid State Science and Technology
Article Type: paper
Copyright Information: © 2020 The Electrochemical Society (“ECS”). Published on behalf of ECS by IOP Publishing Limited. All rights, including for text and data mining, AI training, and similar technologies, are reserved.
Publication dates
Date Received: 2020-06-21
Date Accepted:
Online publication date: 2020-10-12