Wu, YewChung Sermon https://orcid.org/0000-0003-3333-9505
Li, Meiyi
Lai, Tung-Yen
Lu, Tsan-Feng
Wang, Yu Hsiang
Chang, Jiun-Wei
Funding for this research was provided by:
Ministry of Science and Technology, Taiwan (. MOST 108-2221-E-009-063)
Center for Semiconductor Technology Research
Article Title: Effect of Compressive Stress on Evolution and Healing Kinetics of Artificial Voids in Highly (111)-Oriented Cu-Cu Wafer Bonding at 300 °C
Journal Title: ECS Journal of Solid State Science and Technology
Article Type: paper
Copyright Information: © 2021 The Author(s). Published on behalf of The Electrochemical Society by IOP Publishing Limited
Publication dates
Date Received: 2021-01-21
Date Accepted:
Online publication date: 2021-04-09