Xinmeng, Zhai
Yue, Chen
Li, Yuefeng https://orcid.org/0000-0003-3791-4028
Jun, Zou https://orcid.org/0000-0003-4720-2040
Mingming, Shi https://orcid.org/0000-0002-2786-412X
Bobo, Yang https://orcid.org/0000-0003-1351-947X
Yang, Li
Chunfeng, Guo
Rongrong, Hu
Qinglou, Cao
Funding for this research was provided by:
Enterprise-funded Latitudinal Research Projects ((J2016-141))
Shanghai Alliance Plan (LM201978)
the Science and Technology Planning Project of Zhejiang Province, China (2018C01046)
Article Title: Effect of Solder Particle Size on the Mechanical and Thermal Reliability of Au/Sn Ag Cu/Cu Solder Joints
Journal Title: ECS Journal of Solid State Science and Technology
Article Type: paper
Copyright Information: © 2021 The Electrochemical Society (“ECS”). Published on behalf of ECS by IOP Publishing Limited. All rights, including for text and data mining, AI training, and similar technologies, are reserved.
Publication dates
Date Received: 2021-01-05
Date Accepted: 2021-04-06
Online publication date: 2021-04-19