Xinmeng, Zhai
Yue, Chen
Li, Yuefeng https://orcid.org/0000-0003-3791-4028
Jun, Zou https://orcid.org/0000-0003-4720-2040
Mingming, Shi https://orcid.org/0000-0002-2786-412X
Bobo, Yang https://orcid.org/0000-0003-1351-947X
Yang, Li
Chunfeng, Guo
Rongrong, Hu
Qinglou, Cao
Funding for this research was provided by:
Enterprise-funded Latitudinal Research Projects ((J2016-141))
Shanghai Alliance Plan (LM201978)
the Science and Technology Planning Project of Zhejiang Province, China (2018C01046)
Article Title: Effect of Solder Particle Size on the Mechanical and Thermal Reliability of Au/Sn Ag Cu/Cu Solder Joints
Journal Title: ECS Journal of Solid State Science and Technology
Article Type: paper
Copyright Information: © 2021 The Electrochemical Society (“ECS”). Published on behalf of ECS by IOP Publishing Limited
Publication dates
Date Received: 2021-01-05
Date Accepted: 2021-04-06
Online publication date: 2021-04-19