Selbmann, Franz https://orcid.org/0000-0002-1053-2196
Baum, Mario
Meinecke, Christoph
Wiemer, Maik
Kuhn, Harald
Joseph, Yvonne
Funding for this research was provided by:
Fraunhofer Society
Horizon 2020 Framework Programme (732482)
European Social Fund
Article Title: Low-Temperature Parylene-Based Adhesive Bonding Technology for 150 and 200 mm Wafers for Fully Biocompatible and Highly Reliable Microsystems
Journal Title: ECS Journal of Solid State Science and Technology
Article Type: paper
Copyright Information: © 2021 The Author(s). Published on behalf of The Electrochemical Society by IOP Publishing Limited
Publication dates
Date Received: 2021-03-17
Date Accepted:
Online publication date: 2021-07-30