Nagano, F. https://orcid.org/0000-0001-5315-8694
Iacovo, S.
Phommahaxay, A.
Inoue, F.
Chancerel, F.
Naser, H.
Beyer, G.
Beyne, E.
De. Gendt, S.
Article Title: Void Formation Mechanism Related to Particles During Wafer-to-Wafer Direct Bonding
Journal Title: ECS Journal of Solid State Science and Technology
Article Type: paper
Copyright Information: © 2022 The Author(s). Published on behalf of The Electrochemical Society by IOP Publishing Limited
Publication dates
Date Received: 2021-12-23
Date Accepted:
Online publication date: 2022-06-16