Li, Yanpei
Xi, Mengfei
Jiang, Bowen
Li, Xing’ai
Zhang, Yanfeng https://orcid.org/0000-0002-5389-7769
Zhang, Zefang
Funding for this research was provided by:
The development and commercialization of chemical mechanical polishing fluid of the 3rd generation semiconductor SiC (SQ2020YFF0407505)
Article Title: Structure-Performance Relationships of Complexing Agents on the Chemical Mechanical Polishing of 6063 Aluminum Alloy
Journal Title: ECS Journal of Solid State Science and Technology
Article Type: paper
Copyright Information: © 2023 The Electrochemical Society (“ECS”). Published on behalf of ECS by IOP Publishing Limited. All rights, including for text and data mining, AI training, and similar technologies, are reserved.
Publication dates
Date Received: 2022-11-08
Date Accepted:
Online publication date: 2023-04-03