Roshanghias, Ali http://orcid.org/0000-0002-0463-3337
Kaczynski, Jaroslaw
Rodrigues, Augusto
Karami, Reza
Pires, Mariana
Burggraf, Juergen
Schmidt, Andreas
Article Title: 3D Integration via D2D Bump-Less Cu Bonding with Protruded and Recessed Topographies
Journal Title: ECS Journal of Solid State Science and Technology
Article Type: paper
Copyright Information: © 2023 The Author(s). Published on behalf of The Electrochemical Society by IOP Publishing Limited
Publication dates
Date Received: 2023-03-26
Date Accepted:
Online publication date: 2023-08-10