Endo, S. https://orcid.org/0000-0002-6736-3207
Shimizu, A. https://orcid.org/0000-0003-3269-5903
Fukada, K. https://orcid.org/0000-0002-2926-2704
Article Title: Improved Adhesion of Direct Copper Seed Layer by Medium-Vacuum Sputtering Using Vacuum Ultraviolet Light
Journal Title: ECS Journal of Solid State Science and Technology
Article Type: paper
Copyright Information: © 2024 The Author(s). Published on behalf of The Electrochemical Society by IOP Publishing Limited
Publication dates
Date Received: 2023-11-16
Date Accepted:
Online publication date: 2024-02-07