Shimizu, Akihiro https://orcid.org/0000-0003-3269-5903
Fukada, Kazuhiro https://orcid.org/0000-0002-2926-2704
Endo, Shinichi https://orcid.org/0000-0002-6736-3207
Kambara, Shinji https://orcid.org/0000-0001-5870-3751
Article Title: Enhanced Adhesion of Direct Sputtered Copper Seed Layer on Cycloolefin Polymer through Vacuum Ultraviolet Irradiation and Oxygen Plasma Treatment
Journal Title: ECS Journal of Solid State Science and Technology
Article Type: paper
Copyright Information: © 2025 The Author(s). Published on behalf of The Electrochemical Society by IOP Publishing Limited
Publication dates
Date Received: 2024-10-05
Date Accepted:
Online publication date: 2025-04-04