Kuo, Yue https://orcid.org/0000-0003-2757-1842
Su, Jia Quan https://orcid.org/0000-0001-8200-8695
Article Title: A CO 2 Plasma Based Room-Temperature Copper Etch Process
Journal Title: ECS Journal of Solid State Science and Technology
Article Type: paper
Copyright Information: © 2026 The Electrochemical Society (“ECS”). Published on behalf of ECS by IOP Publishing Limited. All rights, including for text and data mining, AI training, and similar technologies, are reserved.
Publication dates
Date Received: 2026-01-09
Date Accepted:
Online publication date: 2026-02-25