Van Cuong, Vuong https://orcid.org/0000-0002-4322-7526
Ishikawa, Seiji
Maeda, Tomonori
Sezaki, Hiroshi
Meguro, Tetsuya https://orcid.org/0000-0002-1158-2662
Kuroki, Shin-Ichiro https://orcid.org/0000-0002-0539-9941
Funding for this research was provided by:
JSPS KAKENHI (JP15KK0240)
JSPS KAKENHI (JP17H03253)
JSPS KAKENHI (JP20H00252)
Article Title: High-temperature reliability of integrated circuit based on 4H-SiC MOSFET with Ni/Nb ohmic contacts for harsh environment applications
Journal Title: Japanese Journal of Applied Physics
Article Type: paper
Copyright Information: © 2020 The Japan Society of Applied Physics. All rights, including for text and data mining, AI training, and similar technologies, are reserved.
Publication dates
Date Received: 2020-09-23
Date Accepted: 2020-11-10
Online publication date: 2020-11-25