Inoue, Fumihiro https://orcid.org/0000-0003-2292-846X
Derakhshandeh, Jaber
Lofrano, Melina
Beyne, Eric
Article Title: Fine-pitch bonding technology with surface-planarized solder micro-bump/polymer hybrid for 3D integration
Journal Title: Japanese Journal of Applied Physics
Article Type: paper
Copyright Information: © 2021 The Japan Society of Applied Physics. All rights, including for text and data mining, AI training, and similar technologies, are reserved.
Publication dates
Date Received: 2020-11-08
Date Accepted: 2020-12-23
Online publication date: 2021-01-20