Article Title: 3D integration technology with photosensitive mold for fan-out package
Journal Title: Japanese Journal of Applied Physics
Article Type: paper
Copyright Information: © 2021 The Japan Society of Applied Physics. All rights, including for text and data mining, AI training, and similar technologies, are reserved.
Publication dates
Date Received: 2020-10-20
Date Accepted: 2021-03-01
Online publication date: 2021-03-17