Article Title: Bonding performance in atomic diffusion bonding of wafers using amorphous Si thin films with smooth surface
Journal Title: Japanese Journal of Applied Physics
Article Type: paper
Copyright Information: © 2022 The Japan Society of Applied Physics. All rights, including for text and data mining, AI training, and similar technologies, are reserved.
Publication dates
Date Received: 2021-12-21
Date Accepted: 2022-02-24
Online publication date: 2022-03-24