Shigekawa, Naoteru https://orcid.org/0000-0001-7454-8640
Liang, Jianbo https://orcid.org/0000-0001-5320-6377
Ohno, Yutaka https://orcid.org/0000-0003-3998-4409
Funding for this research was provided by:
Japan Society for the Promotion of Science (KAKENHI Grant Number 16K13676)
Adaptable and Seamless Technology Transfer Program through Target-Driven R and D
Matching Planner Program
New Energy and Industrial Technology Development Organization ("Research and Development of Ultra-high Efficiency)
Core Research for Evolutional Science and Technology
Article Title: Heterojunctions fabricated by surface activated bonding–dependence of their nanostructural and electrical characteristics on thermal process
Journal Title: Japanese Journal of Applied Physics
Article Type: paper
Copyright Information: © 2022 The Japan Society of Applied Physics. All rights, including for text and data mining, AI training, and similar technologies, are reserved.
Publication dates
Date Received: 2022-04-27
Date Accepted: 2022-10-10
Online publication date: 2022-11-14